In the polishing system of the present invention, a sticking unit (15) sticks the wafer (11) on a carrying plate (12) by liquid. A polishing unit (50) polishes the wafer (11) by a polishing plate. A feeding unit (51) conveys the carrying plate (12) from the sticking unit (15) to the polishing unit (50). A peeling unit (71) peels off the wafer (11) from the carrying plate (12). A first discharging unit (63) conveys the carrying plate (12) from the polishing unit (50) to the peeling unit (71). A cleaning unit (77) cleans the vacant carrying plate (12). A second discharging unit conveys the carrying plate (12) from the peeling unit (71) to the cleaning unit (77). A third discharging unit (81) conveys the carrying plate (12) from the cleaning unit (77) to the sticking unit (77). The units are formed into a loop line, so that the carrying plate (12) is circulated in the loop line and the wafers (11) are polished therein. <IMAGE>
