| 摘要 |
The present invention provides a power lateral diffused metal-oxide semiconductor (power LD MOS) transistor positioned in an active area of a substrate on a semiconductor wafer. The power LD MOS transistor has a source/drain, a first metal layer and a hexagonal-shaped gate. The first metal layer is positioned on a second dielectric layer, covering the first dielectric layer, the gate, and the surface of the substrate, and is electrically connected with the drain via a first plug. A hexagonal-shaped gate positioned on the substrate surrounds the drain, with a first end of the gate positioned on the first dielectric layer and a second end connecting with the source. A second metal layer positioned on the second dielectric layer electrically connects with the drain via a second plug.
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