发明名称 Scalable and modular heat sink-heat pipe cooling system
摘要 Modular heat sinks utilizing heat pipes to provide a more uniform temperature distribution over a packaged integrated circuit and efficient heat sinking in either free or forced convection environments. The heat sinks utilize both horizontal and vertical heat pipes to transfer heat both horizontally and vertically in the heat sinks. Selection of the number of heat pipes used allows tailoring of the heat sink capabilities for different applications using the same fundamental assemblage of parts. Various embodiments are disclosed.
申请公布号 US2002088609(A1) 申请公布日期 2002.07.11
申请号 US20020093279 申请日期 2002.03.07
申请人 TANTOUSH MOHAMMAD A. 发明人 TANTOUSH MOHAMMAD A.
分类号 H01L23/367;H01L23/427;H01L23/467;(IPC1-7):F28D15/00 主分类号 H01L23/367
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