发明名称 |
Light emitting semiconductor package |
摘要 |
A light emitting semiconductor package (250) has a semiconductor chip (252) with a surface with one or more light emitting devices (254) formed on or in the surface. A cap (256) is bonded to the surface of the chip (252) to encapsulate the devices (254). The cap has one or more regions (258) transparent to light emitted by the light emitting devices (254). The cap has been bonded to the semiconductor chip (252) at the wafer stage prior to separation of the wafer into individual packages.
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申请公布号 |
US2002088988(A1) |
申请公布日期 |
2002.07.11 |
申请号 |
US20020040473 |
申请日期 |
2002.01.09 |
申请人 |
SILVERBROOK KIA |
发明人 |
SILVERBROOK KIA |
分类号 |
B29C35/08;B29C43/36;H01L21/56;H01L25/075;H01L33/48;H01L33/56;H01L33/58;(IPC1-7):H01L33/00;H01L23/02 |
主分类号 |
B29C35/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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