| 摘要 |
A module that contains multiple surface acoustic wave (SAW) circuits and a method of manufacturing the module. In one embodiment, the module includes: (1) a hermetically-sealable shell having first and second terminal sets, (2) a first SAW circuit, located within the shell and couplable to the first terminal set, that filters signals in a first band of communications frequencies, and (3) a second SAW circuit, located within the shell and couplable to the second terminal set, that filters signals in a second band of communications frequencies.
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