| 摘要 |
<p>Compositions and methods are provided whereby electronic components (5) may be produced that comprises a) a substrate layer (100); b) an insulator layer (110) coupled to the substrate layer (100), wherein the insulator layer (110) comprises at least two different kinds of embedded passive components (120 and 130); and c) at least one additional layer (140) coupled to insulator layer (110). A preferred method comprises a) imaging an insulator layer (110) to create a first pattern on the insulator layer (110) b) etching the first pattern on the insulator layer (110) to create a first compartment in the insulator layer (110); c) filling the first compartment with a first material to form a first passive component (120); d) imaging the insulator layer (110) to create a second pattern on the insulator layer (110); e) etching the second pattern on the insulator layer (110) to create a second compartment in the insulator layer (110); and f) filling the second compartment with a second material to form a second passive component (130).</p> |
