SEMICONDUCTOR PACKAGE WITH INTERNAL HEAT SPREADER

摘要

A semiconductor package is provided that includes a substrate (7) having a top surface (11), a cover (20), and at least one semiconductor device (9) attached to the top surface of the substrate. The cover is secured to the substrate so as to create a space between the interior surface and the substrate such that the semiconductor device resides within the space. The cover has an interior surface comprising a plurality of micro-channels (30). A wick (50) is positioned in confronting relation to the plurality of micro-channels and the semiconductor device, with a two-phase vaporizable liquid disposed within the space.