| 摘要 |
<p>A technique for processing a wafer (115) in a semiconductor manufacturing process (100) is disclosed. The method comprises first collecting a set of processing rate data from a multi-station processing tool (105), the set including process rate data from at least two stations (110) in the processing tool (105). The collected processing rate data is then communicated to a controller (145) that autonomously compares the processing rate data to determine whether to adjust a process parameter. The method then adjusts the process parameter for at least one station (110) to match the process endpoint for the at least one station (110).</p> |
