LAMINATED CIRCUIT BOARD AND PRODUCTION METHOD FOR ELECTRONIC PART, AND LAMINATED ELECTRONIC PART

摘要

A laminated circuit board capable of being made thinner than conventional circuit boards and not posing a strength problem during handling, and a production method for an electronic part, and a laminated electronic part obtained by this method, wherein a conductor layer is bonded to a transfer film and patterned into a specified pattern, then the transfer film having pattern-formed conductor layer is disposed to face prepreg on its conductor layer side thereof, and the transfer film is press-bonded by heating in a prepreg direction and then is peeled off to obtain a prepreg having a conductor layer and constituting the laminated circuit board.