| 摘要 |
A socket structure for grid array (GA) Packages, mainly comprises the assembly of flexible chassis, the frame, the first hinge cover lid and the second hinge cover lid. The assembly of flexible chassis comprises the silicon rubber pad, the inner base plate and the flex-board, in which the flex-board, encompassing the silicon rubber pad and the inner base plate, is used for electrical contacts. By pressing the first hinge cover lid and the second hinge cover lid downward, the hinge pads thereon contact with the substrate of the package and snap the package firm in place. In this invention, the package with pre-attached heat sink can be easily placed into the socket.
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