发明名称 |
FINE PITCH SYSTEM AND METHOD FOR REINFORCING BOND PADS IN SEMICONDUCTOR DEVICES |
摘要 |
A reinforcing system and method of fabrication for a semiconductor integrated circuit bond pad comprises a first dielectric layer or stack disposed under the bond pad; at least one second dielectric layer or stack disposed under the first dielectric layer; and a reinforcing metal structure disposed into the second dielectric layer such that the patterns of the metal structure and the second dielectric layer comprise a uniformly flat interface towards the first dielectric layer. The patterns of the metal structure and the second dielectric layer comprise feature sizes and fine pitches used in the integrated circuit.
|
申请公布号 |
US2002089062(A1) |
申请公布日期 |
2002.07.11 |
申请号 |
US19990312385 |
申请日期 |
1999.05.14 |
申请人 |
SARAN MUKUL;MARTIN CHARLES A.;COX RONALD H. |
发明人 |
SARAN MUKUL;MARTIN CHARLES A.;COX RONALD H. |
分类号 |
H01L23/485;(IPC1-7):H01L29/40 |
主分类号 |
H01L23/485 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|