| 摘要 |
PURPOSE: A method for fabricating a semiconductor package is provided to decrease the number of processes by forming a semiconductor chip during a semiconductor packaging process, and to maximize memory integration of the semiconductor package. CONSTITUTION: A plurality of via holes are formed on a ceramic substrate of a wafer type. Signal metal is applied in the via holes. An insulation layer is formed on the ceramic substrate. A single silicon thin film is attached to the upper surface of the insulation layer. Various kinds of circuits are formed on the single silicon thin film. A metal pattern is formed on the silicon thin film and the ceramic substrate so that the circuit is electrically connected to the signal metal in the via hole. An encapsulation process is performed to protect the upper surface of the silicon thin film and the ceramic substrate which are electrically interconnected by the metal pattern, and the ceramic substrate is separated into individual packages. |
