Modular high parallelism interface for integrated circuit testing, method of assembly, and use of same

摘要

A high density connector that connects devices under test and a test head that includes coaxial cable connectors on a first end, and connection points located on a male connector portion at a second end, with a waveguide member connecting respective cable connectors and connection points to create a communication pathway having an isolated ground and a 1:1 signal-to-ground ratio. The connector is a PCB, with the waveguides being in a ground-signal-ground configuration with a signal distance between adjacent waveguides being 0.2 inches or less. The coaxial cable connections are modular, allowing cables from the devices under test to be plugged without soldering. This non-solder connection also allows the cables to be unplugged and replugged as necessary. The male connector portion is connected to a female low insertion force connector on the test head in order to complete the connection between the devices under test and the test head.