发明名称 Method for machining glass substrate
摘要 In the present invention, a surface 7 of a glass substrate 1 is irradiated with a laser beam 2 to thereby form a V-shaped groove 6. At that time, the laser beam 2 is condensed outside and above the glass substrate 1. The distance between a beam-condensing point 4 of the laser beam 2 and the surface 7 of the glass substrate 1 is changed to thereby make it possible to change the angle between opposite side surfaces of the V-shaped groove. The angle is in a range of from 30 degrees to 120 degrees. Further, the laser beam used in the present invention is pulsed light, preferably with a pulse width not larger than 10 picoseconds.
申请公布号 US2002090493(A1) 申请公布日期 2002.07.11
申请号 US20010987031 申请日期 2001.11.13
申请人 KAMADA KENJI;OHTA KOJI;YAMAGUCHI JUN;KOYAMA TADASHI 发明人 KAMADA KENJI;OHTA KOJI;YAMAGUCHI JUN;KOYAMA TADASHI
分类号 B23K26/00;B23K26/06;C03C23/00;(IPC1-7):B32B3/00;C03C10/00;C03B27/012;C03B32/00;C03C15/00 主分类号 B23K26/00
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