| 摘要 |
PURPOSE: A semiconductor device is provided to improve work efficiency, by connecting twice as many as input/output terminals in the same area as compared with a conventional technology and by using a through-hole-technology(TFT) method, a surface-mount-technology(SMT) method or a mixed method of TFT and SMT. CONSTITUTION: Contact pads of a substrate module are alternatively disposed. A connecting unit of a socket(20) comes in contact with the upper and lower portion of the same axis. Four signal lines are connected to a planar axis by using the TFT method, the SMT method or the mixed method of TFT and SMT. The signal lines are made of metal.
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