| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition excellent in storage stability, curability, heat resistance, mechanical properties, electrical properties, and the like, and suitably applicable to such uses as a molding, composite material, electrical insulating material, conductive coating material, packaging material for electrical and electronic parts, sealing material for a semiconductor and further, adhesive or coating material, or the like. SOLUTION: This thermosetting resin composition consists of a compound having at least two epoxy groups, a compound having at least two acryloyl and/or methacryloyl groups and an imidazole-based curing catalyst, wherein the content of the imidazole-based catalyst is specified by the mole number of the imidazole groups in the catalyst as 1-15 moles, based on 100 moles of the total mole number of the epoxy groups, acryloyl groups and methacryloyl groups in the above compounds.
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