APPARATUS FOR COOLING ELECTRONIC CHIP

摘要

PURPOSE: An apparatus for cooling an electronic chip is provided to prevent a product defect caused by a conventional screw coupling in an assembly line, by installing a frame unit on the upper surface of a cooling pin of a heat sink. CONSTITUTION: A heat sink(10) closely comes in contact with the heat generating surface of the electronic chip. The heat sink receives heat from the heat generating surface and radiates the heat through a plurality of cooling pins(12) which are installed at a side of the heat sink at regular intervals. A rotating unit has a blade(22) which receives power and ventilates the cooling pin, installed in the cooling pin of the heat sink. The heat sink is formed as one body with a frame part(15) having a space part in which the rotating unit is installed in the center of the cooling pin.