| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing electronic components, which does not cause discoloration due to foreign materials on the surface of a metal sheet, after peeling a resist film, in the method for manufacturing the electronic components by etching the metal sheet, with a photoetching method using the resist film as a mask. SOLUTION: The manufacturing method is characterized by repeatedly using a peeling liquid (7) several times, and controlling a quantity of all Cr in the peeling liquid (7) to be 50 mg/l or less, in the method for manufacturing the electronic components comprising steps of; applying photopolymer on at least one side of a metal sheet (1), and forming the photopolymer layer (2a, 2b); forming a resist film (3a, 3b) having several openings through which the surface of the metal sheet is exposed, according to a predetermined pattern, on at least one side of the metal sheet (1), by subjecting the photopolymer layer (2a, 2b) to a pattern exposure/development process; etching the metal sheet (1) by using the resist film (3a, 3b) as the mask; and peeling the resist film (3a, 3b) by contacting the peeling liquid (7). |
