发明名称 LASER BEAM MACHINING METHOD AND LASER BEAM MACHINING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser beam machining method capable of cutting a machining object, without developing a crack or welding on the surface of the machining object, and efficiently. SOLUTION: Inside the machining object 1, a reforming area is formed by radiating a pulse laser beam L onto the predetermined line 5 for cutting, under the condition of causing multiple photon absorbtion, and making a condensing point P agree with the inside of the machining object 1. The pulse laser beam L is a linear polarized light, and its direction is controlled so as to be along the predetermined line 5 for cutting. By splitting the machining object 1 along the predetermined line 5 for cutting making the reforming area a starting point, the machining object 1 can be cut with a comparatively small force. Since in the irradiation of the laser beam L, the pulse laser beam L is scarcely absorbed on the surface 3 of the machining object 1, the surface 3 is not melted caused by the formation of the reforming area. Since in the reforming area, the size in the direction along the predetermined line 5 for cutting can be made relatively larger, the reforming area along the predetermined line 5 for cutting can be formed with a small shot number.</p>
申请公布号 JP2002192369(A) 申请公布日期 2002.07.10
申请号 JP20010278752 申请日期 2001.09.13
申请人 HAMAMATSU PHOTONICS KK 发明人 FUKUYO FUMITSUGU;FUKUMITSU KENJI;UCHIYAMA NAOKI;WAKUTA TOSHIMITSU
分类号 B28D5/00;B23K26/00;B23K26/06;B23K26/073;B23K26/40;B23K101/40;C03B33/09;H01L21/301;(IPC1-7):B23K26/00 主分类号 B28D5/00
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