发明名称 SOLID ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a solid adhesive composition keeping excellent application performance even by leaving the application part of the solid adhesive over a long period in air. SOLUTION: The solid adhesive composition 20 at least containing an adhesive component, a gelling agent and a solvent and having excellent cap-off performance further contains one or more substances selected from waxes such as paraffin wax and olefin wax exhibiting solid state at normal temperature and having a solubility of <=20% in the solvent and/or a substance absorbing water from the adhesive composition and/or air to form an evaporation suppressing film.
申请公布号 JP2002194320(A) 申请公布日期 2002.07.10
申请号 JP19990370568 申请日期 1999.12.27
申请人 MITSUBISHI PENCIL CO LTD 发明人 TANIZAWA CHO;OSADA TAKAHIRO
分类号 C09J5/00;C09J191/06;C09J191/08;C09J201/00;(IPC1-7):C09J191/06 主分类号 C09J5/00
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