发明名称 LOW-PRESSURE MOLDING, THERMOSETTING RESIN COMPOSITION
摘要 PURPOSE: Provided is a low-pressure molding, thermosetting resin composition comprising 0.5-15 wt%(w/w) of crystalline saturated polyester resin or crystalline unsaturated polyester resin. CONSTITUTION: The low-pressure molding, thermosetting resin composition comprises 0.5-15 wt%(w/w) of crystalline saturated polyester resin or crystalline unsaturated polyester resin. The resin composition comprises 5-30 wt%(w/w) of base, 15-45 wt%(w/w) of stiffener, 30-60 wt%(w/w) of filler, 0.5-35 wt%(w/w) of monomer, 0.01-2 wt%(w/w) of initiator, and 0.1-5 wt%(w/w) of releasing agent. The resin composition further comprises 1-20 wt%(w/w) of low profile agent. The low profile agent is at least one selected from polymethylmethacrylate(PMMA), polyvinyl acetate(PVAc), polyurethane(PU), polystyrene(PS), and polystyrene based copolymer.
申请公布号 KR20020056061(A) 申请公布日期 2002.07.10
申请号 KR20000085345 申请日期 2000.12.29
申请人 HYUNDAI MOTOR COMPANY 发明人 CHOI, CHI HUN;PARK, SANG SEON
分类号 C08L67/00 主分类号 C08L67/00
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