| 摘要 |
PURPOSE: A method for packaging a semiconductor device is provided to form a micro-ball grid array(BGA) of a fan-out structure even if the size of a semiconductor chip decreases, by performing an encapsulation process using an encapsulation case before the semiconductor chip is attached to a lead. CONSTITUTION: The encapsulation case(12) is positioned in the overall frame for packaging the semiconductor device. Tape is attached to the encapsulation case. A predetermined semiconductor chip is positioned on the tape inside the encapsulation case. Encapsulant(15) is injected to fill a space between the semiconductor chip and the encapsulation case. The encapsulation case and the tape are eliminated. A film to which an adhesive layer(16) is attached is positioned on the semiconductor chip, and the semiconductor chip is attached to the film by a predetermined heat treatment process. A lead bonding process is performed for an electrical signal between the semiconductor chip and the film. An encapsulation process is performed to fill a hole formed inside the film. A solder ball(21) is formed on the film.
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