| 摘要 |
PROBLEM TO BE SOLVED: To provide a micro-machined device for micro electomechanical system(MEMS). SOLUTION: This manufacturing method includes a step for preparing a crystalline wafer, and a step for processing, at least, a micro machine device, at least, having a single longitudinal axis, an elongated opening part, and/or a cavity. The longitudinal axis forms an angle to the direction extending along an intersecting line between the surface of the wafer and a cleavage plane and the cleavage plane is regulated as a surface most frequently causing cleavages of the wafer.
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