TRANSMISSION FREQUENCY POWER AMPLIFIER MODULE FOR RADIO COMMUNICATION DEVICE

摘要

PURPOSE: A transmission frequency PAM(Power Amplifier Module) for a radio communication device is provided to prevent a degradation of a produce in advance by improving a heat-sink effect by releasing heat generated from an IP chip outwardly through a main board. CONSTITUTION: A heat conductive layer(110) is formed at an entire upper surface of a main board(100). A circuit board(200) is positioned at an upper side of the main board(100) and includes a dielectric layer(210) and an upper/lower heat conductive layers(220,230) that are coated at an upper and lower sides of the dielectric layer(210). A cavity(240) is formed with a certain width at a central lower surface of the circuit board(200). An IC chip(300) is positioned on the cavity(240) of the circuit board(200) and connected to the lower heat conductive layer(230) of the circuit board(200) through an auxiliary heat conductive layer(310) coated at the lower surface thereof. The auxiliary heat conductive layer(310) is formed by coating AG paste with a certain thickness. The IC chip(300) is connected on the circuit board(200) by wire bonding. A molding layer(400) is coated on the upper surface of the circuit board(200) to cover the both sides of the IC chip(300).