| 摘要 |
<p>PURPOSE: A stacked multichip package is provided to prevent a bonding defect caused by a conventional pellet and to make the upper chip more precisely positioned on the lower chip, by attaching an upper chip to a lower chip while using a solder ball and a solder bump. CONSTITUTION: A solder mask(335) is applied to a region except a wire bond pad of a printed circuit board(PCB)(31). The upper chip(34) is attached to the PCB by using adhesive(32), having a plurality of ball lands in which respective bond pads are interconnected by a metal layer. The lower chip has a ball land of the ball pads, interconnected by a metal layer. Solder balls are interposed between the ball lands of the upper and lower chips. A bonding wire connects the bond pad of the lower chip with the wire bond pad of the PCB. Encapsulant(36) encapsulates the upper surface of the PCB including the upper chip, the lower chip and the bonding wire. A plurality of solder balls are attached to the lower surface of the PCB. The ball lands of the upper and lower chips are formed in the same position so that the upper chip is stacked on the lower chip by the solder ball.</p> |
