| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing method for a polished object that is efficient in polishing on every polished object and can suppress a variation in polishing characteristics such as polishing pressure whether the surface of the polished object is conductive or nonconductive. SOLUTION: The polishing method uses a polishing device 100, which polishes a silicon wafer as the polished object 40 by interposing a liquid crystal system electrorheological fluid functioning as abrasive between a disklike board 10 whose polishing plane 11 carries positive electrodes 11A and negative electrodes 11B opposed in multiple concentric rings, and the silicon wafer arranged with a polished surface 40A thereof opposed to the baseboard 10, and changing the viscosity of the liquid crystal system electroviscous fluid via voltage application while moving the baseboard 10 and the silicon wafer relatively in a direction parallel to the polishing plane 11. |
