IC chip package

摘要

An IC chip package 20 is constructed to comprise a substrate 22, a chip 24, adhesive means 28, and a cover 30. The substrate 22 comprises a top side 22a and a receiving chamber 22c, the receiving chamber 22c having an opening 22f disposed in the top side 22a. The top side 22a of the substrate 22 is provided with a plurality of connecting pads 22g arranged around the opening 22f of the receiving chamber 22c. The chip 24 is fixedly mounted in the receiving chamber 22c and is provided with a plurality of connecting pads 24b respectively electrically connected to the connecting pads 22g of the substrate 22 by means of bonding wires 26. The adhesive means 28 is applied on the connecting area between the bonding wires 26 and the connecting pads 22g of the substrate 22. The cover 30 is fixedly fastened to the adhesive means 28 to close the opening 22f of the receiving chamber 22c.