发明名称 CHEMICAL VAPOR DEPOSITION METHOD FOR COPPER THIN FILM
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a flat CVD copper thin-film on a PVD copper film or a dissimilar metal film, with satisfactory reproducibility in a high growth rate. SOLUTION: This chemical vapor deposition method for growing a copper thin film on a substrate comprises supplying gas of a compound on the substrate, which has aβ-diketone group, includes only oxygen atoms as a heterologous atom, is an aliphatic ketone compound such as 2,4-pentanedione, and is preferably liquid at room temperature. It also comprises supplying gas of an aliphatic ketone compound before growing the copper thin film, during growing it, or after growing a part.
申请公布号 JP2002194545(A) 申请公布日期 2002.07.10
申请号 JP20000390346 申请日期 2000.12.22
申请人 ULVAC JAPAN LTD 发明人 KUSUMOTO TOSHIO;MURATA MASAAKI;ICHIHASHI MOTOKO;OSONO SHUJI
分类号 C23C14/14;C23C16/18;H01L21/28;H01L21/285;(IPC1-7):C23C16/18 主分类号 C23C14/14
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