发明名称 PACKAGE TYPE LASER DIODE UNIT
摘要 PURPOSE: A package type laser diode unit is provided to reflect a laser beam emitted from a laser diode chip on an HOE(Holographic Optical Element) surface via a diffraction grating surface, and to convert the beam into a parallel beam to output the beam, then to make the parallel beam incident on an objective lens to write/read information of a disk, thereby supplying a super-slim combined optical pickup. CONSTITUTION: An LD(Laser Diode)(202) is located in an LD fixing unit(201) of an LD package base(200). A monitor PD(Photo Diode)(204) is located in a PD fixing unit(203). A lens module(205) converts a laser beam emitted from the LD into a parallel beam, and outputs the parallel beam. The lens module is positioned in an optical path to an objective lens(206). The parallel beam emitted from the lens module is focused on an optional point on a disk(207) by the objective lens. One side of the lens module is faced with the LD, and the other side thereof is faced with the monitor PD. A beam output side is faced with the objective lens.
申请公布号 KR20020055778(A) 申请公布日期 2002.07.10
申请号 KR20000085000 申请日期 2000.12.29
申请人 LG ELECTRONICS INC. 发明人 KIM, CHEOL MIN;KIM, HYEON JUN
分类号 G11B7/1372;G11B7/1353;(IPC1-7):G11B7/135 主分类号 G11B7/1372
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