| 摘要 |
PROBLEM TO BE SOLVED: To realize a semiconductor device for which the response speed and mounting ratio are capable of being improved, and of cost reduction. SOLUTION: Electrodes 3 for bump connection are arranged on a wiring board 1 and a semiconductor device 2, or on both surface of a wiring board 1 side and the opposite surface of the semiconductor device 2, which is sandwiched by two semiconductor devices 2. A part or the whole of electrodes 3, formed on one surface, is electrically connected with the electrodes 3 arranged on the other surface. Through-holes 5 are formed, or rewirings 6 which pass a side surface are formed on the semiconductor device 2. As another way, wirings included in resin tapes 7 are formed, or bonding wires 8 are formed. A plurality of the semiconductor devices 2 are laminated by using bump connection, so that the mounting area is made smaller than the total area of the semiconductor devices 2. Connection distance between the semiconductor devices 2 can be significantly reduced, and response speed can be increased by a large amount. |
