| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor package having array electrodes in conjunction with facedown packaging and capable of improving connection accuracy to a socket for carrying out an electric characteristic test. SOLUTION: An IC package 10 is mounted on a socket pedestal 20. External terminals (ball electrodes) 13 are formed on a mounting surface 101 in the form of an array. On the mounting surface 101, recessed parts (hollows) 14 are formed around the arrangement region of the external terminals 13. The recessed parts 14 are used for positioning the IC package. When the IC package 10 undergoes the electric characteristic test (or a burn-in test), the recessed parts 14 are fitted to projections 22 on the socket side to position the IC package. Thereby, the respective external terminals 13 are surely connected to socket terminals 21.</p> |
