| 摘要 |
PURPOSE: A remote circuit board for a radio communication device is provided to form plenty of pads and signal lines by forming a silk layer on a dielectric layer, rather than a multi-type circuit board, easily obtain a ground layer, reduce a unit cost and make a product slim. CONSTITUTION: A pad(110) and a signal line(120) are formed at an upper surface and a lower surface of a dielectric layer(100). A silk layer(200) is formed at an entire upper surface of the dielectric layer(100), on which a pad(210) and a signal line(220) are formed. The pad(210) and the signal line(220) formed on the silk layer(200) are formed of carbon to reinforce their rigidity. The pad(110) and the signal line(120) on the dielectric layer(100) may be formed of carbon. Since the pad(210) and the signal line(220) are separately formed with the silk layer(200), a degree of freedom in designing can be obtained at the maximum, and especially, an area for forming a ground layer can be sufficiently obtained.
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