| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a bonding agent suitably usable for a copper lead frame (a supporting member) and a semiconductor device produced by using the bonding agent and having reduced reflow crack generation at the time of solder reflow and high reliability. SOLUTION: There are disclosed a bonding agent making a semiconductor element bond on a supporting member, a bonding agent having (A) 10% or less of volatile component, (B) 0.3 kgf or more of peel adhesive strength and (C) 15μm or less of curvature variation of chip and a semiconductor device obtained through a wire bonding process and a sealing process after the bonding agent is applied on the supporting member, the semiconductor element is mounted on the supporting member, and the semiconductor element and the supporting member are bonded by heat curing.</p> |
