PURPOSE: A semiconductor package is provided to obviate the necessity of processes for forming an additional via hole on a circuit film and for filling a conductive material in the via hole, by directly melting and attaching a solder ball for grounding to a heat sink and by forming an upwardly bent ground terminal at the corner and sides of the heat sink so that the ground terminal is attached to a mother board. CONSTITUTION: A chip attaching groove(34) is formed in the center of the upper surface of a heat sink(10). A circuit film(18) is attached to the surface of the heat sink except the chip attaching groove by using an adhesive unit. A semiconductor chip(20) is attached to the chip attaching groove of the heat sink by using an adhesive unit. A wire(24) connects a bonding pad of the semiconductor chip with a conductive pattern for wire bonding of the circuit film. A coating material(26) encapsulates the semiconductor chip, the wire and the conductive pattern for wire bonding. Conductive solder balls(32) are melted and attached to a conductive pattern for adhering leads of the circuit film. The edge of the heat sink extends to the outside. A plurality of grooves coated with conductive metal are formed on the upper surface of the extended heat sink. Grounding solder balls are directly attached to the grooves formed on the upper surface of the extended heat sink.
