发明名称 Essentially solventless silicone composition for forming cured release coatings
摘要 <p>An essentially solventless silicone composition for forming a cured release coating comprising (A) 100 parts by weight of a mixture comprising 99 to 90 parts by weight of (A-1) a linear diorganopolysiloxane having a viscosity of 5 to 1,000 mPa.s at 25 DEG C, having both terminal ends of the molecular chain blocked by dimethylalkenylsiloxy groups, with an alkenyl group content of 0.2 to 10 mol% of all organic groups and 1 to 10 parts by weight of(A-2) a linear diorganopolysiloxane having a viscosity of 1,000 to 10,000 mPa.s at 25 DEG C having both terminal ends of the molecular chain blocked by trimethylsiloxy groups and having at least two pendant alkenyl groups bonded to silicon atoms, with an alkenyl group content of 0.05 to 0.5 mol% of all organic groups, (B) 3 to 50 parts by weight of an organohydrogenpolysiloxane having a viscosity of 1 to 1,000 mPa.s at 25 DEG C having at least three silicon-bonded hydrogen atoms per molecule, and (C) a catalytic amount of a platinum catalyst.</p>
申请公布号 EP1221468(A1) 申请公布日期 2002.07.10
申请号 EP20010130858 申请日期 2001.12.27
申请人 DOW CORNING TORAY SILICONE COMPANY, LTD. 发明人 KOYAMA, TAKU;KAIYA, NOBUO
分类号 C09D183/07;C08K5/02;C08K5/5419;C08L83/04;C09D183/04;C09D183/05;(IPC1-7):C09D183/04;C08K5/05;C08K5/541 主分类号 C09D183/07
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