| 发明名称 |
Sound enhanced lapping process |
| 摘要 |
A method of lapping semiconductor wafers includes the step of transmitting sounds generated during the lapping process to a receiver, allowing the operator to use sound to more quickly detect problems associated with starting the lap process.
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| 申请公布号 |
US6416392(B1) |
申请公布日期 |
2002.07.09 |
| 申请号 |
US20000727827 |
申请日期 |
2000.11.30 |
| 申请人 |
SEH AMERICA, INC. |
发明人 |
FITZGERALD BETTINA M.;SWANSON KARL O.;ZINSER DEBRA L. |
| 分类号 |
B24B49/00;(IPC1-7):B24B1/00 |
主分类号 |
B24B49/00 |
| 代理机构 |
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