Method for anodic bonding

摘要

To provide an anodic bonding method which can favorably bond between members different in thermal expansion coefficient. In an anodic bonding method of applying a voltage to and bonding between a first member 10 having a bonding film 11 on a bonding surface and a second member 12 closely put on the bonding surface of the first member 10 through the bonding film 11 in a manner that the first member 10 is rendered as an anode, characterized in that: the bonding film 11 is of a metal film and the second member 12 is of a soda-lime glass, and a bonding temperature is at 100-200° C. and an application voltage is at 0.5-5.0 kV.