发明名称 Substrate processing method and manufacturing method, and anodizing apparatus
摘要 A porous layer is formed on an Si substrate using an anodizing apparatus having a conductive partition inserted between a cathode and an anode. First, the cathode and Si substrate are brought into electrical contact through a first electrolyte, and the conductive partition and Si substrate are brought into electrical contact through a second electrolyte. A current is flowed between the cathode and the anode to form a porous layer on the Si substrate. As the first electrolyte, an electrolyte capable of forming a porous structure on the Si substrate is used. As the second electrolyte, an electrolyte substantially incapable of forming a porous structure on the conductive partition is used.
申请公布号 US6417069(B1) 申请公布日期 2002.07.09
申请号 US20000532071 申请日期 2000.03.21
申请人 CANON KABUSHIKI KAISHA 发明人 SAKAGUCHI KIYOFUMI;MATSUMURA SATOSHI;YAMAGATA KENJI
分类号 H01L21/762;(IPC1-7):H01L21/76 主分类号 H01L21/762
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