Apparatus for cutting wafer sandwiches

摘要

An apparatus for cutting a wafer sandwich into a plurality of rectangular pieces has a support surface defining a transport path extending longitudinally through a longitudinal-cutting station and a transverse-cutting station. A plurality of stationary and transversely spaced longitudinal blades extend across the path in the longitudinal-cutting station. The surface is formed in the transverse-cutting station with a plurality of transversely extending and longitudinally spaced slots. An abutment is displaceable immediately downstream of the transverse-cutting station between a blocking position in the path and a retracted position clear of the path. A plurality of transverse blades are displaceable transversely in the slots of the transverse-cutting station across the path. A conveyor above the surface has pusher elements engageable with the wafer sandwich for pushing it longitudinally in a transport direction along the path through the longitudinal-cutting station, into the transverse-cutting station and against the abutment in the blocking position thereof, and out of the transverse-cutting station in the retracted position of the abutment.