发明名称 Flat interface for a metal-silicon contract barrier film
摘要 A conductive contact having an atomically flat interface. The contact includes, in order, a silicon substrate, a highly disordered silicide layer, and a titanium oxynitride layer. The silicide layer is formed of titanium, silicon, and one of the elements tungsten, tantalum, and molybdenum. The interface between the silicon substrate and the silicide layer is atomically flat. The flat interface prevents diffusion of conductive materials into the underlying silicon substrate. The contact is useful especially for very small devices and shallow junctions, such as are required for ULSI shallow junctions.
申请公布号 US6417567(B1) 申请公布日期 2002.07.09
申请号 US20000482547 申请日期 2000.01.13
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 DOMENICUCCI ANTHONY G.;GIGNAC LYNNE M.;WANG YUN-YU;WILDMAN HORATIO S.;WONG KWONG HON;CARRUTHERS ROY A.;LAVOIE CHRISTIAN;MILLER JOHN A.
分类号 H01L21/28;H01L21/285;H01L21/3205;H01L21/321;H01L21/768;H01L23/52;(IPC1-7):H01L23/48 主分类号 H01L21/28
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