| 摘要 |
A heat sink apparatus for drawing heat from one or more devices and a method of attaching such a heat sink to one or more devices is provided. The heat sink includes a mounting surface, which draws heat into the heat sink where it is dissipated by fins. The heat sink can be mounted next to the device to be cooled with minimum insertion force since the weight of the heat sink is borne by the printed circuit board upon which the electronic device is installed. A rotatable cam is turned by the user, which engages a pivot arm. The pivot arm rotates a number of spring clips against the device thereby holding it in place. Onceina fully closed position, the cam locks into place to prevent the pivot arm and spring clips from rotating back to an open position. The spring clips affix the heat sink and maintains contact between the mounting surface and the device being cooled. The individually articulated spring clips allow the heat sink to be mounted over multiple devices of various dimensions and locations along the heat sink.
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