High temperature flip chip joining flux that obviates the cleaning process

摘要

A fluxing composition is disclosed. The composition comprises a high molecular weight carboxylic acid that forms a combination of carboxylate salts and unreacted acid anhydrides when applied to a solder alloy and exposed to temperatures in the range of about 150 to 350° C. in an inert atmosphere and a carrier fluid comprising a mixture of organic solvents that is heat stable and non-reactive with the solder alloy and has a high viscosity at room temperature. Also disclosed is an integrated circuit assembly comprising an integrated circuit comprising a chip attached to a substrate by a plurality of solder joints and a thin layer of a residue comprising the carboxylate salts and acid anhydride. The film of residue is formed concomitantly with the formation of the solder joints during the reflow cycle. Since the residue is reactive with an epoxy used in bonding the chip to the substrate, the usual process step of cleaning the flux residue prior to dispensing the epoxy is obviated. Methods for preparing a bonded pair of surfacer are also disclosed.