发明名称 |
MOLDING APPARATUS AND MOLDING PROCESS UTILIZING THE SAME |
摘要 |
A process and an apparatus for molding, in which a molten thermoplastic resin is firmly fitted onto a molding surface of a mold under a pressure lower than or equal to 100 kg/cm2 and is cured to obtain a molded product. The molding apparatus has a mold main body, and a mold body on which the molding surface is defined. The mold body is supported relative to the mold main body with maintaining a space on the back side of the molding surface in a heat insulative manner by a supporting member which includes at least a heat insulative supporting member having a thermal conductivity of 0.001 to 1 Kcal/mh .degree.C and a longitudinal elastic modulus of 0.01 to 10 kg/cm2. In the space, a heating fluid for heating the molding surface from the bask side to a temperature higher than or equal to Vicat softening temperate (T) .degree.C of the thermoplastic resin and a cooling fluid for cooling the molding surface from the back side to a temperature lower than or equal to (Vicat softening temperature (T) of the thermoplastic resin - 10) .degree.C are supplied.
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申请公布号 |
CA2173077(C) |
申请公布日期 |
2002.07.09 |
申请号 |
CA19962173077 |
申请日期 |
1996.03.29 |
申请人 |
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发明人 |
KURIHARA, FUMIO;KUMAMOTO, MITSUYOSHI;ITO, YASUHITO;NAGANO, MASANOBU;NAKAMURA, JUN |
分类号 |
B29C35/04;B29C35/08;B29C35/16;B29C49/04;B29C49/20;B29C49/48;B29C49/78;(IPC1-7):B29C49/28;B29C49/64 |
主分类号 |
B29C35/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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