APPARATUS FOR TRANSFERRING WAFER

摘要

PURPOSE: An apparatus for transferring a wafer is provided to minimize generation of scratch on the lower surface of a wafer, by rounding the corner portion of a blade arm and by making a wafer holding portion coated with synthetic resins. CONSTITUTION: The operation of a blade link joint is controlled by a drive unit. The blade arm(120) is installed in the end of the blade link joint. The wafer is held in the blade arm. The corner portion(127) of the blade arm is rounded to prevent the blade arm from being broken when the blade arm collides with the wafer.