SEMICONDUCTOR CHIP STACK PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A semiconductor chip stack package is provided to easily increase a memory capacity by stacking the same kind of chips in one package, and to embody a stack package of a center pad chip by forming an insulation layer at the corner of the chip. CONSTITUTION: The first semiconductor chip(120) has the first active surface(122) in which a plurality of the first electrode pads(124) are formed and the first back surface opposite to the first active surface. The second semiconductor chip(130) has the second active surface(132) in which a plurality of the second electrode pads(134) are formed and the second back surface opposite to the second active surface. The second back surface is attached to the first back surface. A lead frame(110) has a plurality of leads attached to the first active surface. A bonding wire(154) electrically connects the leads with the first and second electrode pads, respectively. A package body(160) encapsulates the first semiconductor chip, the second semiconductor chip, the bonding wire and a part of the lead frame.