| 摘要 |
PURPOSE: A PCB(Printed Circuit Board) is provided to improve a water-resistive characteristic of a flip chip package and a junction reliability of an under fill process, and to prevent a diffusion phenomenon of a solder along a metal trace surface by improving a structure. CONSTITUTION: A PCB comprises a resin layer(7) as a core part, metal traces(2) made of Cu formed to have a defined pattern on the resin layer(7) respectively having a bond pad part(3) on each end of the metal traces(2), metal layers(5) having a water-resistive characteristic coated on the metal traces(2) except for the bond pad parts(3), and a solder mask(4) formed around a semiconductor chip(6) so as to enclose the upper portions of the resultant structure but the lower portion of the semiconductor chip(6).
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