POLISHING MATERIAL FOR DRY BLAST PROCESSING

摘要

PURPOSE: A polishing material for a dry blast processing is provided to effectively prevent troubles caused by water as the coagulation or agglomeration of the polishing material, or the adhesion of the polishing material to an article to be polished, and to achieve high polishing efficiency and high processing accuracy. CONSTITUTION: A polishing material for a dry blast processing is characterized by treating the surfaces of spherical inorganic particles with a water repellency-imparting substance. Fluid reformed substance being below a tenth of the spherical inorganic particles is added 0.01 or 0.5 percent weight to the spherical inorganic particles. The polishing material is used in semiconductor field demanding super precision machining by controlling the shape of the polishing material, maximum particle diameter, and average particle diameter.