| 摘要 |
PURPOSE: Provided is an epoxy resin composition for sealing a semiconductor device, which has an improved shelf stability, by mixing potential hardening catalyst which is an adduct of imidazole and isocyanurate, in appropriate ratio. CONSTITUTION: The epoxy resin composition for sealing a semiconductor device, comprises epoxy resin, hardening agent, hardening catalyst, coupling agent, inorganic filler, fire retardant and releasing agent. The hardening catalyst is a mixture of nonpotential hardening catalyst and potential hardening catalyst represented by formula 1. In the formula 1, R1 represents a methyl group, a benzyl group, a phenyl group or hydrogen atom, and R2 represents a triazinyl group, a methyl group or hydrogen atom. The amount of the hardening catalyst is 0.1-1.0 wt% with respect to the total composition. |
