发明名称 |
JAM DETECTION DEVICE OF MATERIAL TRANSFER APPARATUS FOR SEMICONDUCTOR PACKAGE FABRICATION PROCESS |
摘要 |
PURPOSE: A jam detection device of a material transfer apparatus for semiconductor package fabrication process is provided to prevent damages and errors due to a jam by detecting the jam generated in a push type material transfer apparatus and stopping an operation of the push type material transfer apparatus. CONSTITUTION: A body(1) is moved along a guide member by a driving force. A groove(100) is formed at a front end portion of the body(1). A head(2) is fixed on an inner side of the groove(100) of the body(1) by a hinge. An elastic member(3) is used for connecting one side of the front end portion of the body(1) with one side of the head(2). A sensor(5) is installed at an upper side of the groove(100) in order to detect a rotating state of the head(2). A permanent magnet is adhered to the upper side of the groove(100). The elastic member(3) is formed by a tension spring.
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申请公布号 |
KR20020053932(A) |
申请公布日期 |
2002.07.06 |
申请号 |
KR20000081910 |
申请日期 |
2000.12.26 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
KIM, CHANG HUI |
分类号 |
H01L21/50;(IPC1-7):H01L21/50 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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