PRINTED CIRCUIT BOARD FOR USE OF SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A printed circuit board is provided to significantly reduce electric noises of PCB, while improving electrical performance of semiconductor chip and preventing erroneous operation. CONSTITUTION: A printed circuit board(100) comprises a near plate shaped resin layer; a circuit pattern having a plurality of bond fingers formed onto the upper surface of the resin layer and a plurality of ball lands(4a) formed at the lower surface of the resin layer; a conductive via hole(6) for interconnecting the circuit pattern arranged at the upper and lower surfaces of the resin layer; and a ground line(21) formed at the outer periphery of each of ball lands. A ground ring(22) is formed at the outer periphery of the ball land formed at the outermost part of the lower surface of the resin layer, and the each ground line is connected to the ground ring.